Design & Development Services
Process Development
We develop processes to accommodate your microelectronic packaging and optical assembly needs – from ASIC packaging to electro-optic components.
Service Category
Process Development
Process Optimization
Wire Bonding
Microelectronic Assembly
Multi-Chip Modules
System in Package
Custom Semiconductor Packaging
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Product Lifecycle Services
We can support you from early concept design, through to end of life product manufacturing – we are versatile in how and when we engage with you during this cycle.
Industries Served
Customers benefit from advanced design, manufacturing services and new innovations leveraged from a range of industries and applied to their product.