Design & Development Services
Microelectronic Packaging
We integrate diverse die technologies, that require a deep understanding of the interactions between device design, materials selection and process capability to enable reliable, high performance products.
Service Category
Process Architecture
Multichip Modules & System in Package
Heterogeneous Integration
Product Qualification
Broadband Interconnect
Electro-Optical Integration
Custom Semiconductor Packaging
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Product Lifecycle Services
We can support you from early concept design, through to end of life product manufacturing – we are versatile in how and when we engage with you during this cycle.
Industries Served
Customers benefit from advanced design, manufacturing services and new innovations leveraged from a range of industries and applied to their product.
Automotive
Advancing automotive optical sensing with solid state LIDAR packaging design services and complimentary manufacturing services.
Telecommunication
Providing advanced technology solutions for optical and wireless communication devices that require advanced manufacturing.
Medical
Supplying customer needs for advanced optical and RF subsystems for laboratory diagnostic instruments, wearables and other medical devices.
Defense
Providing design and advanced manufacturing for leading edge phased array radar systems and Satcomm systems.
Explore Related Services
Radio Frequency
We specialize in high frequency, broadband design – including device interconnects and transitions, custom micro RF Components and full subsystems and systems.
Optical
We specialize in the design and development of complex micro-optical systems – getting light into and out of die-level devices, with associated optical elements.
Integrated Solutions
We take your product concept and design and develop turnkey solutions – from small footprint, high performance optical transceivers to medical test systems.
Process Development
We develop processes to accommodate your microelectronic packaging and optical assembly needs – from ASIC packaging to electro-optic components.
Our Mission
We Enable Products
We leverage our core technologies and expertise in Optical, Microelectronics and RF, to enable our customers’ products.
